一、产品介绍Product introduction：

※本机型采用国际先进的特制光纤激光器，光束质量好、体积小、光电转换效率高。长期使用免维护、使用成本低、整机功耗小。

This model adopts international advanced special fiber laser, with good beam quality, small volume and high photoelectric conversion efficiency. Long term use, maintenance free, low cost and low power consumption of the whole machine

※采用进口磁悬浮式直线电机、0.5um高精密光栅尺和全闭环总线系统，具有加工速度快、精度高、维护率低等优点。

The imported maglev linear motor, 0.5um high precision grating ruler and full closed loop bus system are adopted, which have the advantages of fast processing speed, high precision and low maintenance rate.

※ 主要用于氧化铝、氧化锆、氮化铝、氮化硅等先进陶瓷的激光切割和打孔。

It is mainly used for laser cutting and drilling of advanced ceramics such as alumina, zirconia, aluminum nitride and silicon nitride.

※配合CCD视觉定位系统还可以用于金属化陶瓷、芯片基板的切割划线等。

With CCD visual positioning system, it can also be used for cutting and marking of metallized ceramics and chip substrate

※也可用于各种精密的医疗器械、**产品、航空航天等产品的精细微孔加工，*小孔径可达0.02-0.03mm。

It can also be used for fine micropore processing of various precision medical devices, military products, aerospace and other products, with a minimum pore diameter of 0.02-0.03mm

二、产品应用行业Product application industry：

※工业产品：各种工业陶瓷衬板和模具

Industrial products: all kinds of industrial ceramic lining plates and molds。

※PCB行业： 陶瓷电路板的切割打孔划线。

PCB industry: cutting, punching and marking of ceramic circuit boards

※3C行业：陶瓷基板、手机陶瓷背板、中框，电子烟发热片、陶瓷指纹识别盖板等.

3C industry: ceramic substrate, mobile phone ceramic back plate, middle frame, electronic smoke heating plate, ceramic fingerprint identification cover plate, etc

三、技术参数technical parameter：